STM1645-30 rf power module satellite communication applications n class c satellite communications amplifier n 1625- 1665 mhz n 12/28 volts n input/output 50 ohms n pout = 30 w min. n gain = 34.8 db min. description the STM1645-30 hybrid rf power module is designed for high power satellite communication applications in the 1.6 ghz frequency range. high f t , gold metallized silicon microwave power devices, optimized for use in STM1645-30, are employed to provide high gain and efficiency while ensuring excellent reliability. ? pin connections absolute maximum ratings (t case = 25 o c) symbol parameter value unit v dc supply voltage 30 vdc p in rf input power (p out 30 w) 20 mw t stg storage temperature range - 40 to + 100 o c t c operating case temperature -35 to + 70 o c october 1999 1. rf input 2. ground 3. v c1 12v 4. v c2 28v 5. v c3 28v 6. ground 7. rf output branding: STM1645-30 order code : STM1645-30 1/6
electrical specification (t case = 25 o c, v c1* = 12 v; v c2 , v c3 = 28 v) symbol parameter test conditions min. typ. max unit bw frequency range 1625 1665 mhz p out power output p in 10 w 30 35 40 w g p power gain p out = 30 w 34.8 35.5 db h efficiency p out = 30 w 35 % z in input impedance p out = 30 w z g , z l = 50 w 1.5:1 2:1 vswr h harmonics p out = 30 w reference -45 -40 db d p out vs t case t c = -35 o c to +70 o c @ p in = 10mw 2 db d p out vs frequency f = 1625 - 1665 mhz 1 db load mismatch vswr = 10:1 v = 28 vdc p out = 30 w no degradation in output power p out control range p out = 30 w 8 10 db stability p out = 5 to 30 w** load vswr = 3:1 any phase all spurious outputs more than 60 db below carrier note : * v c1 = 12 v regulated 1% ** p out adjusted by varying v c3 ref. 1015506i STM1645-30 2/6
power output vs frequency and power input v control vs collector efficiency power gain vs frequency and power input v control vs power output and i c3 (typical) typical performance STM1645-30 3/6
operation limits the STM1645-30 power module should never be operated under any condition which exceeds the absolute maximum ratings presented on this data sheet. nor should the module be operated continuously at any of the specified maximum ratings. if the module is to be subjected to one or more of the maximum rating conditions, care must be taken to monitor other parameters which may be affected. module mounting to insure adequate thermal transfer from the module to the heatsink, it is recommended that a satisfactory thermal compound such as dow corning 340, wakefield 120-2 or equivalent be applied between the module flange and the heatsink. the heatsink mounting surface under the module should be flat to within 0.05 mm ( 0.002 inch) . the module should be mounted to the heatsink using 3.5 mm (or 6-32) or equivalent screws torqued to 5-6 kg-cm (4-6 in-lb). the module leads should be attached to equipment pc board using 180 o c solder applied to leads with a properly grounded soldering iron tip, not to exceed 195 o c, applied a minimum of 2 mm (0.080 inch) from the body of the module for a duration not to exceed 15 seconds per lead. it is imperative that no other portion of the module, other than the leads, be subjected to temperature in excess of 100 o c (maximum storage temperature), for any period of time, as the plastic moulded cover, internal components and sealing adhesives may be advertisely affected by such conditions. due to the construction techniques and materials used within the module, reflow soldering of the flange heatsink or leads, is not recommended. applications recommendations STM1645-30 4/6
1016819c h160 mechanical data STM1645-30 5/6
information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsib ility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectroni cs. specifi cation mentio ned in this publication are subject to change without notice. this publication supersedes and replaces all in formation previou sly supplied. stmicroe lectron ics products are not authorized for use as critical components in life support devices or systems without express written approval of stmicroelectron ics. the st logo is a trademark of stmicroelectronics ? 1999 stmicroelectronics C pr inted in italy C all rights reserved stmicroelectronics group of companies australia - brazil - china - finland - france - germany - hong kong - india - italy - japan - malay sia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - u.s.a. http://www.st.com . STM1645-30 6/6
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